The present invention provides a forming method capable of improving an edge appearance. The method comprises the following steps: providing a carrier, wherein the carrier is provided with a containing groove, and the containing groove comprises a bottom surface and side walls extending upwardly from the edges of the bottom surface; forming an adhesive layer on the surface of the carrier, and fixing bare dies on the bottom surface of the containing groove via the adhesive layer; filling a forming compound in the containing groove, and wrapping the bare dies with the forming compound; placing the carrier in a forming mold, combining the carrier with the forming mold to form mold, and forming a forming wafer wrapping the bare dies in the containing groove; demolding; and separating the forming wafer from the carrier. According to the method, by using a special carrier structure, the contacting edge of the forming wafer and the adhesive layer is not very sharp, so that the problems of particulate pollutants or crack are avoided in the subsequent process, and thus the method has the advantage of improving the yield of packaging products.