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Invention Publication
CN107236975A 能够电镀大尺寸化经光致抗蚀剂限定的特征的铜电镀浴和电镀方法 有权

能够电镀大尺寸化经光致抗蚀剂限定的特征的铜电镀浴和电镀方法
Abstract:
本发明提供允许在高电流密度下镀覆具有基本上均匀的形态和减少的节结产生的经光致抗蚀剂限定的大型特征的铜电镀浴和方法。所述铜电镀浴包括提供具有良好TIR％和WID％平衡的大型特征的杂环含氮共聚物的混合物。
Abstract(English):

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.

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