The invention discloses a through silicon via daisy chain testing device for a wide I/O memory. The testing device comprises a testing head and a conversion interface. The conversion interface comprises a signal transmission board and a socket board. The socket board comprises a plurality of first data contacts, a plurality of second data contacts and a plurality of driving contacts. The socket body also has a shared line for connecting the first data contacts and the second data contacts in a Y-shaped manner. The signal transmission board is electrically connected with corresponding I/O pins of the testing head. A to-be-tested through silicon via device comprises a plurality of channels. When the to-be-tested through silicon via device is loaded on the socket board, the channels are successively connected in series in a daisy chain structure. The series connection starting point of the daisy chain structure comprises the first data contact, the second data contact and the driving contact. Therefore, through the through silicon via daisy chain testing device for the wide I/O memory, the number of the to-be-tested assemblies of a testing bench can be increased.