The invention discloses a plating solution and method for chemically plating Ni-P on the surface of a carbon nano tube. The chemical plating solution is characterized by comprising 18-34 g/L of nickel sulfate (NiSO4.6H2O), 10-20 g/L of citric acid (C6H8O7.H2O), 15-25 mL/L of lactic acid (C3H6O3), 8-16 g/L of anhydrous sodium acetate (CH3COONa), 20-30 g/L of sodium hypophosphite (NaH2PO2.H2O) and 80-120 mL/L of anhydrous alcohol (C2H5OH). The chemical plating method comprises the steps that the carbon nano tube is soaked into the anhydrous alcohol and subjected to alkaline washing and acid pickling, then, the carbon nano tube is put into the chemical plating solution, plating is conducted by controlling the PH value and the temperature, and the Ni-P is deposited onto the surface of a substrate of the carbon nano tube to form a plating layer. According to the plating solution and the method, operation and implementation are easy, and the economical efficiency is good. The carbon nano tube is expected to achieve appropriate-strength interfacial adhesion in an aluminum base composite material, and Al4C3 is effectively inhibited from being generated too much.