The invention provides a circuit board structure and a manufacturing method therefor. The manufacturing method for the circuit board structure comprises the following steps: a glass membrane is provided on an electrostatic chuck, a plurality of first conduction holes are formed in the glass membrane, a first line layer is formed on an upper surface of the glass membrane, the first line layer is enabled to be in electric connection with the first conduction holes, a first polymer layer is formed on the first line layer, the first polymer layer covers a surface of the first line layer and the upper surface of the glass membrane, a plurality of second conduction holes are formed in the first polymer layer, a second line layer is formed on the first polymer layer, and the second line layer is enabled to be in electric connection with the second conduction holes. The electrostatic chuck is removed. Via the circuit board structure and the manufacturing method therefor, warp problems can be solved, and reliability and yield rates of products can be improved.