The invention relates to the technical field of methods for depositing nickel, palladium and gold, in particular to a method for depositing nickel, palladium and gold on a small-spacing PCB (printed circuit board). The method comprises the following steps: acid washing, water washing, micro-etching, water washing, pre-soaking, activation, water washing, post-soaking, water washing, chemical nickel, water washing, chemical palladium, water washing, chemical gold and water washing; in the process of activation, the activation temperature is 78+/-3 DEG C and the activation time is 800+/-10S; in the process of chemical nickel, the temperature of a chemical nickel tank is 63+/-2 DEG C, and the service life of the chemical nickel tank is less than or equal to 2.5MTO; and in the process of chemical palladium, the temperature of a chemical palladium tank is 43+/-3 DEG C, and the service life of the chemical palladium tank is less than or equal to 3MTO. The invention aims to provide a method for depositing nickel, palladium and gold on the small-spacing PCB, and solves the undesirable technical problems of gold permeation, fat edges and the like of a conventional small-spacing PCB in a normal process of depositing nickel, palladium and gold by adopting the technical scheme provided by the invention.