Provided are a semiconductor chip and an electronic device. The semiconductor chip includes a substrate, one or more conductive pads disposed on the substrate, and one or more bumps electrically connected to the one or more conductive pads, in which the one or more bumps includes a metal core, a polymer layer disposed over a surface of the metal core, and a conductive coating layer disposed over asurface of the polymer layer and electrically connected to the one or more conductive pads.