An embodiment of the present invention relates to a composition for an anisotropic conductive film, the composition containing: a copolymerized compound of a fluorene-based compound and a bisphenol type epoxy compound; an epoxy resin having an epoxy equivalent of 150 g/eq or less; a curing agent; and conductive particles. Another embodiment of the present invention relates to an anisotropic conductive film comprising: a copolymerized compound of a fluorene-based compound and a bisphenol type epoxy compound; and conductive particles, wherein the film has a particle capturing rate, according to equation 1, of 30% or more and an adhesive strength of 10 MPa or more, which are measured after the film is preliminarily compressed in conditions of 1.0-3.0 Mpa at 50-80℃ for 1-3 seconds and mainly compressed in conditions of 60-80 Mpa at 120-160℃ for 3-6 seconds. [Equation 1] Particle capturing rate (%) = (number of conductive particles per unit area (mm2) in a contact site after preliminary compression and main compression) / (number of conductive particles per unit area (mm2) of anisotropic conductive film before preliminary compression) × 100