The invention discloses a method for manufacturing a semiconductor encapsulation device by laser. In combination with a laser technology, as a semiconductor is encapsulated by a ceramic material serving as a substrate, the precision is high, and the manufacturing complexity is relatively low; meanwhile, an end electrode is provided for the encapsulation device, and can be directly assembled to anelectrical appliance module; and therefore, the space is saved, and the assembling efficiency of the electrical appliance module is improved.