The invention provides a chip package structure comprising a flexible film, a plurality of first pins, a plurality of second pins, a chip and a patterning metal layer; the chip and the first pins arearranged on the first surface of the flexible film; the patterning metal layer and the second pins are arranged on a second surface opposite to the first surface of the flexible film; the first pins are respectively jointed with a plurality of first and second bosses of the chip; positions of the patterning metal layer and partial the first pins overlap with joint portions of the first and secondbosses; at least one first pin and a corresponding local area of the joint portion of either the first boss or the second boss is exposed by a first window area of the patterning metal layer; a support portion of the patterning metal layer overlaps with said joint portions. The chip package structure can improve the jointing yield between the bosses on the chip and pins on the flexible film.