The invention relates to an encapsulation method and display equipment. The encapsulation method comprises the following steps: moulding a buffer film layer and a semiconductor film layer on a substrate; preparing a first metal insulation composite structure layer, wherein the first metal insulation composite structure layer comprises a first interlayer insulation layer and a first metal film layer; etching the first metal insulation composite structure layer by an imaging technology and a dry etching technology, to form a first metal layer pattern, wherein the first metal layer pattern has ablank area, a first metal mesh area and a second metal mesh area, the blank area separates the first metal mesh area from the second metal mesh area, a first mask through hole is formed in the first metal mesh area, and a second mask through hole is formed in the second metal mesh area; and preparing a second metal insulation composite structure layer. According to the encapsulation method and thedisplay equipment, the product structure and the processing method realize tight combination of the sintered layer and a backboard, and the encapsulation reliability of the display equipment is guaranteed.