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Invention Publication
CN108476608A 导电片的装配结构和电子设备 有权

  • Patent Title: 导电片的装配结构和电子设备
  • Patent Title (English): FITTING STRUCTURE FOR CONDUCTIVE SHEET AND ELECTRONIC DEVICE
  • Application No.: CN201680079486.X
    Application Date: 2016-12-14
  • Publication No.: CN108476608A
    Publication Date: 2018-08-31
  • Inventor: 早樋学
  • Applicant: NEC平台株式会社
  • Applicant Address: 日本神奈川县
  • Assignee: NEC平台株式会社
  • Current Assignee: NEC平台株式会社
  • Current Assignee Address: 日本神奈川县
  • Agency: 中科专利商标代理有限责任公司
  • Agent 倪斌
  • Priority: 2016-022673 2016.02.09 JP
  • International Application: PCT/JP2016/087193 2016.12.14
  • International Announcement: WO2017/138246 JA 2017.08.17
  • Date entered country: 2018-07-19
  • Main IPC: H05K9/00
  • IPC: H05K9/00
导电片的装配结构和电子设备
Abstract:
本发明的导电片的装配结构包括：导电构件(10)，布置在包括前壳体(61)和后壳体(62)在内的电子设备的前壳体(61)内的预定区域内，前壳体(61)和后壳体(62)是彼此可分离地接合的第一壳体片和第二壳体片，并且该导电构件电连接到电子设备的接地图案(SG、FG)；以及6导电片(20)，包括导电层(21)，并且布置在后壳体(62)内以与前壳体(61)的预定区域相对。在前壳体(61)和后壳体(62)彼此接合的状态下，导电片(20)的导电层(21)与导电构件(10)接触，并电连接到电子设备的接地图案(SG、FG)。
Abstract(English):

This fitting structure for a conductive sheet comprises: a conductive member (10) which is arranged within a predetermined region in a front case (61) of an electronic device that has the front case (61) and a rear case (62), said cases being first and second case pieces that are separably joined to each other, and which is electrically connected to ground patterns (SG, FG) of the electronic device; and a conductive sheet (20) which is arranged within the rear case (62) so as to face the predetermined region of the front case (61) and comprises a conductive layer (21). In a state where the front case (61) and the rear case (62) are joined with each other, the conductive layer (21) of the conductive sheet (20) is in contact with the conductive member (10) and is electrically connected to the ground patterns (SG, FG) of the electronic device.

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