The invention provides a TFT array substrate. The invention discloses a third conductive layer which is connected with a first conductive layer and a second conductive layer through a first via hole and a second via hole. Moreover, the third conductive layer is provided with a first opening and a second opening, which are separated from each other. The projection of the first opening in a verticaldirection is located at one side of the edge of the bottom of the second via hole, and one end of the first opening is bulged out of one end, close to the first via hole, of the edge of the bottom ofthe second via hole. The projection of the second opening in a vertical direction is located at one side of the edge of the bottom of the first via hole, and one end of the second opening is bulged out of one end, close to the second via hole, of the edge of the bottom of the first via hole. Therefore, when the third conductive layer is cracked at the edges, getting close to each other, of the first and second via holes because of static breakdown, the first and second openings can achieve the blocking of the crack, thereby preventing the crack from causing the breaking of the first conductive layer and the second conductive layer, guaranteeing the connection reliability of the first conductive layer and the second conductive layer, and improving the quality of a product.