A manufacturing method for an LED array apparatus, using vertical structure LED devices and a motherboard, the LED devices being provided with a first magnetic part made of a soft magnetic metal; the motherboard is provided with second magnetic parts made of a hard magnetic material, and: a non-magnetic insulating base layer is arranged on a first board surface; a drive circuit layer comprising a plurality of solder pads is arranged on the base layer, the solder pads corresponding to the second magnetic parts; the LED devices are dispersed on the drive circuit layer, the first magnetic parts thereof being subjected to the action of the magnetic field of the second magnetic parts on the solder pads, such that the LED devices are attached in place onto the solder pads; bonding the LED devices to the solder pads; and separating the base layer from the motherboard to obtain an LED array apparatus. The present method can rapidly and efficiently transfer and bond a large amount of LED devices onto a drive circuit layer.