The invention provides an integrated circuit packaging method and a semiconductor device. The method comprises the following steps of: (a) identifying a bottom plate pasted with an integrated circuitbare chip, generating a plastic package model according to identification information of the bottom plate pasted with the integrated circuit bare chip, and on the bottom plate pasted with the integrated circuit bare chip, connecting contact electrode of the integrated circuit bare chip with pins on the bottom plate in a one-to-one correspondence manner through bonding wires; and (b) according to the plastic package model, forming a plurality of overlapped and insulated light-cured adhesive layers sequentially on the side, where the integrated circuit bare chip is pasted, of the bottom plate, coating the integrated circuit bare chip and the bonding wires with the light-cured adhesive layers. The overlapped and insulated light-cured adhesive layers are formed sequentially on the side, wherethe integrated circuit bare chip is pasted, of the bottom plate to avoid the warping of the lead frame and snapping of the bonding wires in the plastic package process and improve the percent of passof integrated circuit packaging.