The invention discloses a design and forming process of a naturally-formed thick and short hourglass-shaped welding spot. The welding spot is naturally formed into a thick and short hourglass-shaped welding spot under the condition of no external force, wherein the increased section area of the tail end of the welding spot can greatly relieve stress at the tail end of the welding spot, and therefore, the service life of the welding spot in temperature circulation is prolonged. The welding spot is used for electronic packaging (generally called semiconductor packaging), more precisely, interconnection of electronic packaging, such as interconnection between a chip and a chip, between chips and chip packaging, between chip packaging and chip packaging, and between chip packaging and a board.