The utility model provides a resin molded body for a surface mounting type luminescence device, and the surface mounting type luminescence device. The resin molded body for the surface mounting type luminescence device realizes one-body integration of cured resin and multiple leading wires and has a concave portion, the multiple leading wires are exposed out from a bottom portion of the concave portion, ten point height (Rz) of microcosmic unflatness of an opening face of the concave portion is greater than 1mum and smaller than 10mum, glass-transition temperature of the cured resin is greater than 10 DEG C, the glass-transition temperature is a value measured under conditions that a thermal mechanical analysis device (TMA) is utilized, a temperature scope is -50-250 DEG C, a temperature rising speed is 5 DEG C per minute and sample dimension length is in a range of 1-5mm, the opening face of the concave portion has a light reflection rate of greater than 80% for wavelength 460nm light, after the resin molded body is heated 72 hours under 180 DEG C, a retention rate of the light reflection rate through the opening face of the concave portion is greater than 90%.