Improved-reliability damascene interconnects and process of manufacture.

Invention Patent

HK1036150A1 Improved-reliability damascene interconnects and process of manufacture. 未知

Patent Title: Improved-reliability damascene interconnects and process of manufacture.
Application No.: HK01106779

Application Date: 2001-09-26
Publication No.: HK1036150A1

Publication Date: 2001-12-21
Inventor: CLEVENGER LARRY , FILIPPI RONALD G , GAMBINO JEFFREY , GIGNAC LYNNE , HURD JEFFERY L , HOINKIS MARK , IGGULDEN ROY C , MEHTER EBRAHIM , RODBELL KENNETH P , SCHNABEL FLORIAN , WEBER STEFAN J
Applicant: IBM , SIEMENS AG
Assignee: IBM,SIEMENS AG
Current Assignee: IBM,SIEMENS AG
Priority: HK01106779 2001-09-26
Main IPC: H01L
IPC: H01L20060101 ; H01L

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）