Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US15297365Application Date: 2016-10-19
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Publication No.: US10020263B2Publication Date: 2018-07-10
- Inventor: Kyoung Yeon Lee , Tae Yong Lee , Min Chul Shin , Se Man Oh
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2016-0042986 20160407
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/40 ; H01L23/538 ; H01L23/15 ; H01L23/31 ; H01L23/00
Abstract:
Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.
Public/Granted literature
- US20170294412A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-10-12
Information query
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