Invention Grant
- Patent Title: Wiring harness attaching structure
-
Application No.: US14672496Application Date: 2015-03-30
-
Publication No.: US10023134B2Publication Date: 2018-07-17
- Inventor: Yasumasa Osada , Gaku Ito
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2012-221130 20121003; JP2013-202171 20130927
- Main IPC: B60L1/00
- IPC: B60L1/00 ; B60L3/00 ; H02G3/00 ; B60R16/02 ; B60R13/02 ; H02G3/04 ; H02G3/38

Abstract:
An object of the present invention is to provide a wiring harness attaching structure aiming at improvement in attaching workability and aiming at thinning of a vehicle door. Provided is a wiring harness attaching structure for attaching a wiring harness to a vehicle interior outer surface of a door trim constituting a vehicle door. The wiring harness is a flat cable whose width dimension is longer than a thickness dimension, is located inside a structure body containing gas phase, and is provided integrally with the structure body containing gas phase. The structure body containing gas phase is attached along the vehicle interior outer surface of the door trim. The wiring harness is attached to the door trim together with the structure body containing gas phase.
Public/Granted literature
- US20150203058A1 WIRING HARNESS ATTACHING STRUCTURE Public/Granted day:2015-07-23
Information query
IPC分类: