Invention Grant
- Patent Title: Method for installing integrated circuit devices on a substrate
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Application No.: US14975352Application Date: 2015-12-18
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Publication No.: US10057994B2Publication Date: 2018-08-21
- Inventor: Thomas A. Boyd , Michael Z. Eckblad
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes Davda & Victor LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K7/12 ; H01L23/40

Abstract:
In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.
Public/Granted literature
- US20160105974A1 INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A SUBSTRATE Public/Granted day:2016-04-14
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