Invention Grant
- Patent Title: Epoxy resin compositions and thermal interface materials comprising the same
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Application No.: US14974616Application Date: 2015-12-18
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Publication No.: US10059866B2Publication Date: 2018-08-28
- Inventor: Yen-Chun Liu , Hui-Wen Chang , Hsiang-Yen Tsao , Kuo-Chan Chiou
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW104140492A 20151203
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/24 ; C08G59/50 ; C09K5/14 ; C08G59/22 ; H01L23/373 ; C09J163/00 ; B32B27/38

Abstract:
An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.
Public/Granted literature
- US20170158932A1 EPOXY RESIN COMPOSITIONS AND THERMAL INTERFACE MATERIALS COMPRISING THE SAME Public/Granted day:2017-06-08
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