Invention Grant
- Patent Title: Plating catalyst and method
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Application No.: US13775208Application Date: 2013-02-24
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Publication No.: US10066299B2Publication Date: 2018-09-04
- Inventor: Suk Kwan Kwong , Weijuan Zhou , Wenjia Zhou , Dennis Chit Yiu Chan , Dennis Kwok-Wai Yee
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: B05D1/18
- IPC: B05D1/18 ; C23C18/31 ; B01J31/06 ; B01J23/44 ; B01J35/00 ; C23C18/30 ; H05K3/42 ; C23C18/18 ; C23C18/20 ; H05K3/18 ; B01J37/02 ; B01J23/38 ; B01J23/50 ; C23C18/38 ; H05K3/38 ; B01J37/16

Abstract:
A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has π electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.
Public/Granted literature
- US20140242287A1 PLATING CATALYST AND METHOD Public/Granted day:2014-08-28
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