Invention Grant
- Patent Title: Non-contact substrate processing
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Application No.: US13786189Application Date: 2013-03-05
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Publication No.: US10074555B2Publication Date: 2018-09-11
- Inventor: Blake Koelmel , Nyi O. Myo
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C23C16/458 ; C23C16/52 ; C23C16/54 ; H01J37/32 ; H01L21/683
Abstract:
Embodiments of the present invention provide apparatus and methods for supporting, positioning or rotating a semiconductor substrate during processing. One embodiment of the present invention provides a method for processing a substrate comprising positioning the substrate on a substrate receiving surface of a susceptor, and rotating the susceptor and the substrate by delivering flow of fluid from one or more rotating ports.
Public/Granted literature
- US20130224962A1 NON-CONTACT SUBSTRATE PROCESSING Public/Granted day:2013-08-29
Information query
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