Invention Grant
- Patent Title: Blind via printed circuit board fabrication supporting press fit connectors
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Application No.: US14886790Application Date: 2015-10-19
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Publication No.: US10080287B2Publication Date: 2018-09-18
- Inventor: Kevin W. Mundt , Jason D. Adrian
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Zagorin Cave LLP
- Agent Robert W. Holland
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; H05K3/00 ; H05K3/42 ; H01R12/58 ; H05K3/30 ; H05K3/46

Abstract:
An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.
Public/Granted literature
- US20160050756A1 Blind Via Printed Circuit Board Fabrication Supporting Press Fit Connectors Public/Granted day:2016-02-18
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