中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

6 records (took 0.013 seconds)

    Modular dense storage array
    1.
    发明授权
    Modular dense storage array 有权

    公开(公告)号：US10317957B2

    公开(公告)日：2019-06-11

    申请号：US15079584

    申请日：2016-03-24

    Applicant: Dell Products, L.P.

    Inventor： Jason D. Adrian ,  Douglas L. Farley

    IPC: H05K7/00 ,  G06F1/18 ,  H05K7/14

    Abstract: Modular dense storage arrays are disclosed. In some embodiments, a modular storage array may include a chassis configured to receive a plurality of drive bay modules, a first of the plurality of drive bay modules configured to receive a first plurality of storage drives in the absence of a drive adaptor, each of the first plurality of storage drives having a first form factor, and a second of the plurality of drive bay modules configured to receive a second plurality of storage drives in the absence of the drive adaptor, each of the second plurality of storage drives having a second form factor different from the first form factor.

    Modular Dense Storage Array
    3.
    发明申请
    Modular Dense Storage Array 审中-公开
    模块密集存储阵列

    公开(公告)号：US20160202738A1

    公开(公告)日：2016-07-14

    申请号：US15079584

    申请日：2016-03-24

    Applicant: Dell Products, L.P.

    Inventor： Jason D. Adrian ,  Douglas L. Farley

    IPC: G06F1/18

    CPC classification number: G06F1/187 ,  H05K7/1494 ,  Y10T29/49826

    Abstract: Modular dense storage arrays are disclosed. In some embodiments, a modular storage array may include a chassis configured to receive a plurality of drive bay modules, a first of the plurality of drive bay modules configured to receive a first plurality of storage drives in the absence of a drive adaptor, each of the first plurality of storage drives having a first form factor, and a second of the plurality of drive bay modules configured to receive a second plurality of storage drives in the absence of the drive adaptor, each of the second plurality of storage drives having a second form factor different from the first form factor.

    Abstract translation: 公开了模块密集存储阵列。 在一些实施例中，模块化存储阵列可以包括被配置为接收多个驱动器托架模块的底盘，所述多个驱动器托架模块中的第一个被配置为在没有驱动器适配器的情况下接收第一多个存储驱动器， 所述第一多个存储驱动器具有第一形状因数，并且所述多个驱动器托架模块中的第二多个驱动器托架模块被配置为在没有所述驱动器适配器的情况下接收第二多个存储驱动器，所述第二多个存储驱动器中的每一个具有第二 形状因子与第一种形状因子不同。

    Blind Via Printed Circuit Board Fabrication Supporting Press Fit Connectors
    4.
    发明申请
    Blind Via Printed Circuit Board Fabrication Supporting Press Fit Connectors 审中-公开
    盲孔通过印刷电路板制造支撑压配合连接器

    公开(公告)号：US20160050756A1

    公开(公告)日：2016-02-18

    申请号：US14886790

    申请日：2015-10-19

    Applicant: Dell Products L.P.

    Inventor： Kevin W. Mundt ,  Jason D. Adrian

    IPC: H05K1/11 ,  H05K3/42 ,  H05K3/36 ,  H01R12/70 ,  H05K3/00

    CPC classification number: H05K1/115 ,  H01R12/585 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/306 ,  H05K3/421 ,  H05K3/4611 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2203/1476 ,  Y10T29/49126

    Abstract: An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.

    Abstract translation: 信息处理系统电路板通过将具有连接器中的控制器压力的第一电路板部分耦合到具有多个表面连接器的第二电路板部分，将设置在相对侧上的存储装置表面连接器和存储装置控制器接合。 第一和第二电路板部分通过固化而激活的粘合剂彼此连接。 在第一电路板部分的开口上印刷耐油墨，其中施加粘合剂以防止粘合剂在粘合剂固化期间或之前流入开口。

    BLIND VIA PRINTED CIRCUIT BOARD FABRICATION SUPPORTING PRESS FIT CONNECTORS
    6.
    发明申请
    BLIND VIA PRINTED CIRCUIT BOARD FABRICATION SUPPORTING PRESS FIT CONNECTORS 有权
    黑色印刷电路板制造支持新闻联播

    公开(公告)号：US20140083754A1

    公开(公告)日：2014-03-27

    申请号：US13628532

    申请日：2012-09-27

    Applicant: DELL PRODUCTS L.P.

    Inventor： Kevin W. Mundt ,  Jason D. Adrian

    IPC: H05K1/11 ,  H05K3/36 ,  H05K1/00

    CPC classification number: H05K1/115 ,  H01R12/585 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/306 ,  H05K3/421 ,  H05K3/4611 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2203/1476 ,  Y10T29/49126

    Abstract: An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.

    Abstract translation: 信息处理系统电路板通过将具有连接器中的控制器压力的第一电路板部分耦合到具有多个表面连接器的第二电路板部分，将设置在相对侧上的存储装置表面连接器和存储装置控制器接合。 第一和第二电路板部分通过固化而激活的粘合剂彼此连接。 在第一电路板部分的开口上印刷耐油墨，其中施加粘合剂以防止粘合剂在粘合剂固化期间或之前流入开口。

Patent Agency Ranking