Invention Grant
- Patent Title: Semiconductor module and electronic device
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Application No.: US15381857Application Date: 2016-12-16
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Publication No.: US10083938B2Publication Date: 2018-09-25
- Inventor: Mitsutaka Yamada , Masumi Suzuki , Michimasa Aoki , Jie Wei
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-005072 20160114
- Main IPC: H01L23/46
- IPC: H01L23/46 ; H01L25/065 ; H01L25/16 ; H01L23/04 ; H01L23/44
Abstract:
A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.
Public/Granted literature
- US20170207144A1 SEMICONDUCTOR MODULE AND ELECTRONIC DEVICE Public/Granted day:2017-07-20
Information query
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