公开(公告)号：US10537043B2

公开(公告)日：2020-01-14

申请号：US16000949

申请日：2018-06-06

Applicant: FUJITSU LIMITED

Inventor： Michimasa Aoki ,  Yosuke Tsunoda ,  Keizou Takemura ,  Kenji Katsumata ,  Masumi Suzuki ,  Jie Wei

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/467 ,  H01L23/427 ,  G06F1/18

Abstract: An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

公开(公告)号：US10108235B2

公开(公告)日：2018-10-23

申请号：US15722337

申请日：2017-10-02

Applicant: FUJITSU LIMITED

Inventor： Shunichi Kikuchi ,  Michimasa Aoki ,  Masumi Suzuki ,  Mitsutaka Yamada

IPC: G06F1/20

Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

公开(公告)号：US20160374230A1

公开(公告)日：2016-12-22

申请号：US15196677

申请日：2016-06-29

Applicant: FUJITSU LIMITED

Inventor： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Kenji Katsumata

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/473 ,  G06F1/20

CPC classification number: H05K7/20254 ,  F28D15/00 ,  F28D15/0266 ,  F28F1/22 ,  F28F3/12 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K7/20154 ,  H05K7/20436 ,  H01L2924/00

Abstract: A cooling jacket includes: first and second pipe portions through which a coolant flows; and a main portion connected with side surfaces of the first and second pipe portions, defining, with a single member, a flow path through which the coolant flows, and cooling an object to be cooled.

Abstract translation: 冷却套包括：冷却剂流过的第一和第二管部分; 以及与第一和第二管部分的侧表面连接的主要部分，其用单个构件限定冷却剂流过的流动路径，并冷却待冷却的物体。

公开(公告)号：US09223362B2

公开(公告)日：2015-12-29

申请号：US14028963

申请日：2013-09-17

Applicant: FUJITSU LIMITED

Inventor： Masayuki Watanabe ,  Kenji Sasabe ,  Eiji Wajima ,  Masumi Suzuki ,  Michimasa Aoki

IPC: H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20772 ,  H01L2924/00

Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

Abstract translation: 电子设备包括风扇，位于风扇产生的气流下游的电路板，安装在电路板上的至少一个处理器，位于风扇产生的气流下游的散热器，散热器冷却 液体冷却剂，管单元，其包括其中冷却剂流动的受热构件和冷却剂管道，所述热接收构件安装在所述处理器上，以及所述冷却剂管道使所述液体冷却剂在所述散热器和所述受热构件之间循环， 其上安装有存储器封装的至少一个存储器板，所述存储器板安装在所述电路板上，并且所述存储器板和所述管单元沿着垂直于所述风扇吹扫所述气流的方向的方向布置。

公开(公告)号：US10575444B2

公开(公告)日：2020-02-25

申请号：US15960609

申请日：2018-04-24

Applicant: FUJITSU LIMITED

Inventor： Yosuke Tsunoda ,  Jie Wei ,  Masumi Suzuki ,  Michimasa Aoki ,  Keizou Takemura

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  G06F1/20 ,  H01L23/467 ,  G06F1/18 ,  H01L23/427

Abstract: An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

公开(公告)号：US09603285B2

公开(公告)日：2017-03-21

申请号：US13953838

申请日：2013-07-30

Applicant: FUJITSU LIMITED

Inventor： Masumi Suzuki ,  Michimasa Aoki ,  Jie Wei

IPC: F04B9/117 ,  H05K7/20 ,  F04D13/12 ,  F04B23/04

CPC classification number: H05K7/20272 ,  F04B9/117 ,  F04B23/04 ,  F04D13/12 ,  H05K7/202 ,  H05K7/20263 ,  H05K7/20636 ,  Y10T137/86163 ,  Y10T137/87265

Abstract: A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.

公开(公告)号：US20140334095A1

公开(公告)日：2014-11-13

申请号：US14341301

申请日：2014-07-25

Applicant: FUJITSU LIMITED

Inventor： Masumi Suzuki ,  Michimasa Aoki ,  Yosuke Tsunoda ,  Masaru Sugie ,  Shinichirou Kouno ,  Hiroshi Muto ,  Kenji Katsumata

IPC: F28D15/00 ,  G06F1/20

CPC classification number: F28D15/00 ,  F28D1/0476 ,  F28D2021/0031 ,  F28F9/0214 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.

Abstract translation: 散热器包括：冷却剂流过的管; 以及单个罐，包括：与所述管的端部连通的供应室，用于向所述管提供所述冷却剂; 以及与管的另一端连通并分配到供应室的收集室，并用于收集从管排出的冷却剂。

公开(公告)号：USD714235S1

公开(公告)日：2014-09-30

申请号：US29447662

申请日：2013-03-05

Applicant: Fujitsu Limited

Designer： Masayuki Watanabe ,  Yoshinori Uzuka ,  Kenji Sasabe ,  Eiji Wajima ,  Fumihiro Tawa ,  Takeshi Nishiyama ,  Jie Wei ,  Masumi Suzuki ,  Michimasa Aoki

公开(公告)号：US08564951B1

公开(公告)日：2013-10-22

申请号：US13673282

申请日：2012-11-09

Applicant: Fujitsu Limited

Inventor： Masayuki Watanabe ,  Kenji Sasabe ,  Eiji Wajima ,  Masumi Suzuki ,  Michimasa Aoki

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20772 ,  H01L2924/00

Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

公开(公告)号：US10362712B2

公开(公告)日：2019-07-23

申请号：US15372685

申请日：2016-12-08

Applicant: FUJITSU LIMITED

Inventor： Michimasa Aoki ,  Masumi Suzuki

IPC: H05K7/20

Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.