Invention Grant
- Patent Title: Protective film applying apparatus and protective film applying method
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Application No.: US15623933Application Date: 2017-06-15
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Publication No.: US10086474B2Publication Date: 2018-10-02
- Inventor: Senichi Ryo , Kenta Nakano , Yukinobu Ohura , Toshiyuki Yoshikawa
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2016-125503 20160624
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B23K26/18 ; H01L21/78 ; H01L21/66 ; B23K26/364 ; B05B3/02 ; B05D1/00 ; B23K101/40
Abstract:
A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.
Public/Granted literature
- US20170368636A1 PROTECTIVE FILM APPLYING APPARATUS AND PROTECTIVE FILM APPLYING METHOD Public/Granted day:2017-12-28
Information query
IPC分类:
