Invention Grant
- Patent Title: Decoupling capacitor on strain relaxation buffer layer
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Application No.: US15298733Application Date: 2016-10-20
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Publication No.: US10090307B2Publication Date: 2018-10-02
- Inventor: Karthik Balakrishnan , Kangguo Cheng , Pouya Hashemi , Alexander Reznicek
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/8238 ; H01L21/02 ; H01L27/092 ; H01L29/08 ; H01L29/165 ; H01L29/78 ; H01L49/02

Abstract:
An electrical device including a substrate structure including a relaxed region of alternating layers of at least a first semiconductor material and a second semiconductor material. A first region of the substrate structure includes a first type conductivity semiconductor device having a first strain over a first portion of the relaxed region. A second region of the substrate structure includes a second type conductivity semiconductor device having a second strain over a second portion of the relaxed region. A third region of the substrate structure including a trench capacitor extending into relaxed region, wherein a width of the trench capacitor defined by the end to end distance of the node dielectric for the trench capacitor alternates between at least two width dimensions as a function of depth measured from the upper surface of the substrate structure.
Public/Granted literature
- US20170213884A1 DECOUPLING CAPACITOR ON STRAIN RELAXATION BUFFER LAYER Public/Granted day:2017-07-27
Information query
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