Invention Grant
- Patent Title: Device with electrode connected to through wire, and method for manufacturing the same
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Application No.: US14818153Application Date: 2015-08-04
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Publication No.: US10090780B2Publication Date: 2018-10-02
- Inventor: Shinan Wang , Yutaka Setomoto
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2014-161989 20140808
- Main IPC: G01B7/16
- IPC: G01B7/16 ; H02N1/00 ; B06B1/02 ; B81C1/00 ; H01L21/768 ; G01L1/14 ; H01L23/48

Abstract:
A capacitive transducer includes a substrate having a first surface and a second surface opposite the first surface, the substrate including a through wire extending therethrough between the first surface and the second surface, and a cell on the first surface, the cell including a first electrode and a second electrode spaced apart from the first electrode with a gap between the first electrode and the second electrode. Conductive protective films are disposed over surfaces of the through wire on the first surface side and the second surface side of the substrate.
Public/Granted literature
- US20160043660A1 DEVICE WITH ELECTRODE CONNECTED TO THROUGH WIRE, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-02-11
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