Abstract:
The present invention offers a device requiring a reduced number of manufacturing processes and providing high electrical reliability, and a method for manufacturing the device. The method for manufacturing the device forms through holes in a substrate, fills the through holes with a conductive material through electroplating from a first surface side of the substrate, polishes the conductive material to form through wirings, and forms an element portion on the first surface side. Then, the method processes the substrate so that the positions of the end faces of the through wirings measured from the substrate surface on the first surface side are made smaller in depth than the positions of the end faces of the through wirings measured from the substrate surface on the second surface side.
Abstract:
A method of manufacturing an ejection orifice member includes: preparing a substrate including a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second and third layers being formed on the first direction side of the first layer, the preparing a substrate including forming the second layer to follow a contour of a first direction side surface of the first layer, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; performing plating using the second layer as a seed to form a fourth layer on the first direction side of the second layer; removing the third layer from the fourth layer to form a hole as the ejection orifice in the fourth layer; and thinning the fourth layer at least around the hole.
Abstract:
A liquid ejection head has a plurality of pressure chambers each communicating with an ejection port at one end and with an ink supply port at the other end. Each of the pressure chambers has lateral walls formed by piezoelectric elements and configured so as to eject ink from the corresponding ejection port as a result of a capacity change of the pressure chamber due to an expansion or contraction of the piezoelectric elements. The liquid ejection head is constituted by a plate-shaped piezoelectric portion and a plurality of column-shaped piezoelectric portions arranged thereon. The plate-shaped piezoelectric portion has a plurality of holes and a plurality of through holes located around the holes. Each of the column-shaped piezoelectric portions has a hollow section. Each hole of the plate-shaped piezoelectric portion and the hollow section of the corresponding column-shaped piezoelectric portion form a pressure chamber.
Abstract:
A process for producing a liquid ejection head having a piezoelectric body provided with an ejection orifice for ejecting liquid and a pressure chamber communicating therewith for retaining the liquid, wherein an electrode is formed on an inner wall surface of the pressure chamber to deform the pressure chamber by piezoelectric action caused by applying voltage to the electrode to eject the liquid, comprising providing the piezoelectric body in which a surface thereof having the ejection orifice has an arithmetic mean roughness of 0.1-1 μm, forming a dry film resist pattern on the surface of the piezoelectric body so as to expose the ejection orifice and a linear region connected thereto, and forming a metal thin film pattern being connected to the electrode on the inner wall surface and continuously extending from the inner wall surface to the linear region by using the dry film resist pattern as a mask.
Abstract:
A capacitive transducer includes a substrate having a first surface and a second surface opposite the first surface, the substrate including a through wire extending therethrough between the first surface and the second surface, and a cell on the first surface, the cell including a first electrode and a second electrode spaced apart from the first electrode with a gap between the first electrode and the second electrode. Conductive protective films are disposed over surfaces of the through wire on the first surface side and the second surface side of the substrate.
Abstract:
In a method of producing a device in which an element structure is provided on a substrate including a through wiring, a through hole is formed so as to extend from a first surface of the substrate to a second surface of the substrate disposed on an opposite side of the substrate to the first surface, the through wiring is formed by filling the through hole with an electrically conductive material, and the element structure is formed on a first surface side. In the step of forming the through hole, a degree of surface irregularities of an inner wall of the through hole is larger on the first surface side than on a second surface side.
Abstract:
The present invention offers a device requiring a reduced number of manufacturing processes and providing high electrical reliability, and a method for manufacturing the device. The method for manufacturing the device forms through holes in a substrate, fills the through holes with a conductive material through electroplating from a first surface side of the substrate, polishes the conductive material to form through wirings, and forms an element portion on the first surface side. Then, the method processes the substrate so that the positions of the end faces of the through wirings measured from the substrate surface on the first surface side are made smaller in depth than the positions of the end faces of the through wirings measured from the substrate surface on the second surface side.
Abstract:
A capacitive transducer includes a substrate having a first surface and a second surface opposite the first surface, the substrate including a through wire extending therethrough between the first surface and the second surface, and a cell on the first surface, the cell including a first electrode and a second electrode spaced apart from the first electrode with a gap between the first electrode and the second electrode. Conductive protective films are disposed over surfaces of the through wire on the first surface side and the second surface side of the substrate.
Abstract:
The present inventions provide a capacitive transducer that can reduce film damage on a substrate surface on a vibration film side due to a difference in thermal expansion coefficient between a through wiring and a substrate and a method of manufacturing the same. The capacitive transducer consists of a plurality of cells with each cell comprising a first electrode and a vibration film on a first surface side of a substrate having a through wiring that penetrates the substrate from a first surface to a second surface of the substrate, the vibration film including a second electrode that is formed with a gap from the first electrode. A holding member that holds a leading end of the through wiring is provided on the first surface side of the substrate.
Abstract:
The present inventions provide a capacitive transducer that can reduce film damage on a substrate surface on a vibration film side due to a difference in thermal expansion coefficient between a through wiring and a substrate and a method of manufacturing the same. The capacitive transducer consists of a plurality of cells with each cell comprising a first electrode and a vibration film on a first surface side of a substrate having a through wiring that penetrates the substrate from a first surface to a second surface of the substrate, the vibration film including a second electrode that is formed with a gap from the first electrode. A holding member that holds a leading end of the through wiring is provided on the first surface side of the substrate.