Invention Grant
- Patent Title: Module, module component composing the module, and method of manufacturing the module
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Application No.: US14832201Application Date: 2015-08-21
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Publication No.: US10098229B2Publication Date: 2018-10-09
- Inventor: Yoichi Takagi , Tadashi Nomura , Masato Yoshida , Nobuaki Ogawa , Mitsuhiro Matsumoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2013-035012 20130225; JP2013-156564 20130729
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01L23/498 ; H01L23/538 ; H01L25/16 ; H05K3/28 ; H05K1/09 ; H05K3/34

Abstract:
To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.
Public/Granted literature
- US20150366063A1 MODULE, MODULE COMPONENT COMPOSING THE MODULE, AND METHOD OF MANUFACTURING THE MODULE Public/Granted day:2015-12-17
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