公开(公告)号：US10861683B2

公开(公告)日：2020-12-08

申请号：US15427721

申请日：2017-02-08

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Issei Yamamoto ,  Atsushi Shimizu ,  Yoichi Takagi ,  Hideo Nakagoshi ,  Toru Komatsu ,  Hideki Shinkai ,  Tetsuya Oda

IPC: C23C14/34 ,  H01J37/34 ,  C23C14/50 ,  C23C14/20 ,  H01J37/32

Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

公开(公告)号：US20140182918A1

公开(公告)日：2014-07-03

申请号：US14200901

申请日：2014-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuaki Ogawa ,  Yoichi Takagi

IPC: H05K1/02 ,  H05K3/32

CPC classification number: H05K1/0213 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/32 ,  Y10T29/49147

Abstract: A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component 102 and the terminal assembly 10 mounted on the one principal surface of the wiring substrate 101, with a first resin layer 103. Also, since the plurality of connection terminals 11 are merely supported by the support body 12, the support body 12 can be easily removed from the plurality of connection terminals 11. Accordingly, the manufacturing time of the module 100 is decreased.

Abstract translation: 可以通过安装电子部件102和具有简单构造的端子组件10来精确地制造模块100，其中多个连接端子11由支撑体12支撑，该构造高度精确，便宜且新颖， 在布线基板的一个主表面上; 并且通过密封安装在布线基板101的一个主表面上的电子部件102和端子组件10与第一树脂层103.另外，由于多个连接端子11仅由支撑体12支撑， 支撑体12可以容易地从多个连接端子11移除。因此，模块100的制造时间减少。

公开(公告)号：US09491846B2

公开(公告)日：2016-11-08

申请号：US14200901

申请日：2014-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuaki Ogawa ,  Yoichi Takagi

IPC: H05K3/30 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H05K3/32 ,  H01L23/538

CPC classification number: H05K1/0213 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/32 ,  Y10T29/49147

Abstract: A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component 102 and the terminal assembly 10 mounted on the one principal surface of the wiring substrate 101, with a first resin layer 103. Also, since the plurality of connection terminals 11 are merely supported by the support body 12, the support body 12 can be easily removed from the plurality of connection terminals 11. Accordingly, the manufacturing time of the module 100 is decreased.

Abstract translation: 可以通过安装电子部件102和具有简单构造的端子组件10来精确地制造模块100，其中多个连接端子11由支撑体12支撑，该构造高度精确，便宜且新颖， 在布线基板的一个主表面上; 并且通过密封安装在布线基板101的一个主表面上的电子部件102和端子组件10与第一树脂层103.另外，由于多个连接端子11仅由支撑体12支撑， 支撑体12可以容易地从多个连接端子11移除。因此，模块100的制造时间减少。

公开(公告)号：US09293446B2

公开(公告)日：2016-03-22

申请号：US14603433

申请日：2015-01-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuhiro Matsumoto ,  Yoichi Takagi ,  Tadashi Nomura ,  Akihiko Kamada ,  Nobuaki Ogawa ,  Kensei Nishida

IPC: H01L23/31 ,  H01L25/16 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/50

CPC classification number: H01L25/165 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/056 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/12042 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.

Abstract translation: 提供了具有通过增加部件安装密度而实现的高功能性的低轮廓模块。 尽管通过在布线基板101的两个主表面101a和101b上分别安装诸如半导体基板104和芯片部件105的部件来实现模块100中的高功能性，但是可以提供低轮廓模块100，其具有 通过形成通过仅将半导体衬底104仅仅安装在布线基板101的一个主表面101a上而形成的第一部件层102的厚度Ha，从而增加其部件安装密度，从而提高其高功能性，使其小于厚度 通过将多个芯片部件105安装在布线基板101的另一个主表面101b上而形成的第二部件层103。

公开(公告)号：US09113571B2

公开(公告)日：2015-08-18

申请号：US13920375

申请日：2013-06-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideo Nakagoshi ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Hidekiyo Takaoka ,  Kosuke Nakano

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/284 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10477 ,  H01L2924/00

Abstract: In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.

Abstract translation: 在导电性接地部和连接端子部件之间的接合部分中，至少具有Cu-Sn系，M-Sn系（M表示Ni和/或Mn）以及Cu 制造的M-Sn系金属间化合物被配置成存在于连接端子部件侧。 在该金属间化合物的制造区域中，当将接合部分的横截面在长度方向和横向方向等同地限定为10个盒子以总共限定100个盒子时，每个盒子的至少两个 具有不同组成元素的金属间化合物的类型存在于除了盒中除了仅存在Sn基金属成分之外的盒子总数的约70％以上。

公开(公告)号：US10256195B2

公开(公告)日：2019-04-09

申请号：US15846541

申请日：2017-12-19

Applicant: Murata Manufacturing Co., Ltd

Inventor： Issei Yamamoto ,  Atsushi Shimizu ,  Yoichi Takagi ,  Hideo Nakagoshi

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/28 ,  H05K9/00 ,  C23C14/00 ,  C23C14/06 ,  C23C14/14 ,  C23C14/24 ,  H01L21/285 ,  H01L21/3205 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16

Abstract: A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.

公开(公告)号：US20150103495A1

公开(公告)日：2015-04-16

申请号：US14576452

申请日：2014-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideo Nakagoshi ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Hidekiyo Takaoka ,  Kosuke Nakono ,  Akihiko Kamada ,  Masaaki Mizushiro

IPC: H05K7/02 ,  H05K1/18

CPC classification number: H05K7/02 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/186 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/047

Abstract: A plating layer of a Cu—M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu—M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu—M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Abstract translation: 在暴露侧的连接端子构件的端面上形成Cu-M系合金的镀层（M表示Ni和/或Mn），Cu-M系合金能够产生金属间化合物 所述Sn基低熔点金属包含在形成接合部分并且具有不同于金属间化合物的晶格常数的接合材料中的50％以上。 在回流工序中，即使接合材料通过再熔化即将流出，由于接合材料与Cu-M系镀层接触，所以金属间化合物的高熔点合金 形成为阻挡连接端子构件和树脂层之间的界面。

公开(公告)号：US20140262442A1

公开(公告)日：2014-09-18

申请号：US14181036

申请日：2014-02-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi Nomura ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Akihiko Kamada

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4007 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/113 ,  H05K3/243 ,  H05K3/3436 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/1327

Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Abstract translation: 模块包括电路板，树脂层，外部连接导体，焊​​料凸块。 树脂层设置在电路板的第一主表面上。 外部连接导体布置在树脂层中，具有连接到电路板的第一端和通过树脂层的表面突出的第二端，并且包括沿着树脂层的表面延伸的突出部分，突出部分 树脂层的表面。 焊料凸点设置在外部连接导体的第二端上。

公开(公告)号：US11302593B2

公开(公告)日：2022-04-12

申请号：US16928090

申请日：2020-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshitaka Matsukawa ,  Yoichi Takagi ,  Akio Katsube ,  Yoshitaka Echikawa

IPC: H01L23/28 ,  H01L23/495 ,  H01L23/00 ,  H05K3/28 ,  H05K9/00

Abstract: An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

公开(公告)号：US10098229B2

公开(公告)日：2018-10-09

申请号：US14832201

申请日：2015-08-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoichi Takagi ,  Tadashi Nomura ,  Masato Yoshida ,  Nobuaki Ogawa ,  Mitsuhiro Matsumoto

IPC: H05K1/14 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H05K3/28 ,  H05K1/09 ,  H05K3/34

Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.