A composite carrier is disclosed for warpage management as a temporary carrier in semiconductor process. Warpage is reduced for a product, semi-product, or build-up layer processed on the temporary composite carrier which is peeled off the temporary carrier in a later step. The composite carrier comprises a top substrate and a bottom substrate, an adhesive layer is configured in between the top substrate and a bottom substrate. One of the embodiments discloses the top substrate of the composite carrier having a lower CTE and the bottom substrate of the composite carrier having a higher CTE.