Invention Grant
- Patent Title: Manufacturing method for compound semiconductor device
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Application No.: US15591697Application Date: 2017-05-10
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Publication No.: US10115802B2Publication Date: 2018-10-30
- Inventor: Taku Sato
- Applicant: ADVANTEST CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Cantor Colburn LLP
- Priority: JP2016-121845 20160620
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L21/306 ; H01L21/304 ; H01L21/3065 ; H01L21/18

Abstract:
A support substrate is bonded to a GaN epitaxial substrate including at least an electron transport layer and an electron supply layer grown on a growth substrate in the Ga-polar direction such that the support substrate faces the Ga-plane of the GaN epitaxial substrate. Furthermore, at least the growth substrate is removed from the GaN epitaxial substrate so as to expose an N-plane of the GaN epitaxial substrate. Subsequently, a semiconductor element is formed on the N-plane side.
Public/Granted literature
- US20170365689A1 MANUFACTURING METHOD FOR COMPOUND SEMICONDUCTOR DEVICE Public/Granted day:2017-12-21
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