Invention Grant
- Patent Title: Stress memorization technique for strain coupling enhancement in bulk finFET device
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Application No.: US15840344Application Date: 2017-12-13
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Publication No.: US10170364B2Publication Date: 2019-01-01
- Inventor: Kangguo Cheng , Juntao Li , Chun-Chen Yeh
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L21/8234 ; H01L29/66 ; H01L29/10 ; H01L29/78 ; H01L21/762 ; H01L21/265 ; H01L21/324 ; H01L29/06 ; H01L29/08 ; H01L21/306 ; H01L21/308 ; H01L27/088 ; H01L27/092 ; H01L21/84

Abstract:
A method for forming strained fins includes etching trenches in a bulk substrate to form fins, filling the trenches with a dielectric fill and recessing the dielectric fill into the trenches to form shallow trench isolation regions. The fins are etched above the shallow trench isolation regions to form a staircase fin structure with narrow top portions of the fins. Gate structures are formed over the top portions of the fins. Raised source ad drain regions are epitaxially grown on opposite sides of the gate structure. A pre-morphization implant is performed to generate defects in the substrate to couple strain into the top portions of the fins.
Public/Granted literature
- US20180102290A1 STRESS MEMORIZATION TECHNIQUE FOR STRAIN COUPLING ENHANCEMENT IN BULK FINFET DEVICE Public/Granted day:2018-04-12
Information query
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