Invention Grant
- Patent Title: Alignment mark structure with dummy pattern
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Application No.: US15238595Application Date: 2016-08-16
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Publication No.: US10192832B2Publication Date: 2019-01-29
- Inventor: Kai-Jen Hsiao , Chun-Yun Tsai , Cheng-Yi Hsu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/31 ; H01L23/29
Abstract:
An alignment mark structure including a substrate, an alignment mark and at least one dummy pattern is provided. The alignment mark is disposed on the substrate. The at least one dummy pattern is disposed on the substrate and located adjacent to the alignment mark, wherein a size of the at least one dummy pattern is smaller than a size of the alignment mark.
Public/Granted literature
- US20180053729A1 ALIGNMENT MARK STRUCTURE WITH DUMMY PATTERN Public/Granted day:2018-02-22
Information query
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