Invention Grant
- Patent Title: Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chip
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Application No.: US15924707Application Date: 2018-03-19
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Publication No.: US10195849B2Publication Date: 2019-02-05
- Inventor: Hitoshi Nakayama , Takeshi Sugiyama , Daichi Nishikawa , Eriko Maeda
- Applicant: SII Printek Inc.
- Applicant Address: JP Chiba
- Assignee: SII PRINTEK INC.
- Current Assignee: SII PRINTEK INC.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2017-056388 20170322
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
Channel grooves for a discharge channel and a non-discharge channel are formed in the surface of an actuator plate by cutting. The discharge channel includes an extension portion and a raise-and-cut portion, and the non-discharge channel also includes an extension portion and a raise-and-cut portion. In an embodiment, an electrode clearance groove is formed in advance by cutting with a dicing blade or the like. After the electrode clearance groove is formed, an electrode is formed by plating. Since plating is performed after the electrode clearance groove is formed, a clearance groove electrode is integrally formed with an AP-side common pad in the electrode clearance groove, and thus the clearance groove electrode and the AP-side common pad are short-circuited. Thus, an electrode separation portion is formed by cutting a short-circuited portion of the clearance groove electrode and the AP-side common pad through cutting or irradiation with laser.
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Information query
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