Invention Grant
- Patent Title: Semiconductor package assembly
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Application No.: US15481500Application Date: 2017-04-07
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Publication No.: US10199318B2Publication Date: 2019-02-05
- Inventor: Nai-Wei Liu , Tzu-Hung Lin , I-Hsuan Peng , Che-Hung Kuo , Che-Ya Chou , Wei-Che Huang
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L23/538 ; H01L25/10
Abstract:
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure. The RDL structure includes a conductive trace. A redistribution layer (RDL) contact pad is electrically coupled to the conductive trace. The RDL contact pad is composed of a symmetrical portion and an extended wing portion connected to the symmetrical portion. The extended wing portion overlaps at least one-half of a boundary of the symmetrical portion when observed from a plan view.
Public/Granted literature
- US20170338175A1 SEMICONDUCTOR PACKAGE ASSEMBLY Public/Granted day:2017-11-23
Information query
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