Described herein are radio-frequency (RF) modules that include shielding for improved RF performance. The RF modules including a packaging substrate with a receiving system implemented thereon. The RF module includes a shield implemented to provide RF shielding for at least a portion of the receiving system. The receiving system can include any combination of pre-amplifier or post-amplifier bandpass filters, amplifiers, switching networks, impedance matching components, phase-shifting components, input multiplexers, and output multiplexers. The shielding can include a conductive layer within a conformal shielding on an upper side and side walls of the RF module. The shielding can be an overmold formed over the packaging substrate. The conductive layer can be connected to one or more ground planes. The packaging substrate can include contact features on an underside of the substrate for mounting an underside component.