公开(公告)号：US12261127B2

公开(公告)日：2025-03-25

申请号：US17655801

申请日：2022-03-22

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Anthony James LoBianco ,  Hoang Mong Nguyen ,  Matthew Sean Read ,  Howard E. Chen ,  Ki Wook Lee ,  Yi Liu

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00

Abstract: A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

公开(公告)号：US11063002B2

公开(公告)日：2021-07-13

申请号：US16734356

申请日：2020-01-05

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Hoang Mong Nguyen ,  Luis Eduardo Herrera ,  Sergio Joaquin Gonzalez Flores ,  Matthew Sean Read ,  Anthony James Lobianco ,  Heliodoro Osuna

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/49 ,  H01L23/66 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.

公开(公告)号：US10586010B2

公开(公告)日：2020-03-10

申请号：US16022413

申请日：2018-06-28

Applicant: Skyworks Solutions, Inc.

Inventor： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC: H01L21/02 ,  H01L21/28 ,  H01L21/44 ,  H01L21/56 ,  H01L21/58 ,  H01L21/71 ,  H01L23/02 ,  H01L23/48 ,  H01L23/58 ,  H01L23/64 ,  H01L23/552 ,  G06F17/50 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66

Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

公开(公告)号：US10242143B2

公开(公告)日：2019-03-26

申请号：US15046258

申请日：2016-02-17

Applicant: Skyworks Solutions, Inc.

Inventor： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC: G06F17/50 ,  H05K1/18 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/58 ,  H01L23/66

Abstract: Aspects of the present disclosure relate to a racetrack that forms part of an RF isolation structure of a packaged module and wireless devices that include such a packaged module. The racetrack can be disposed in a substrate and around an RF component that is on the substrate. The racetrack can include at least one break and/or at least one narrowed section without significantly degrading the EMI performance of the RF isolation structure.

公开(公告)号：US10211181B2

公开(公告)日：2019-02-19

申请号：US15485134

申请日：2017-04-11

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Matthew Sean Read

IPC: H01L23/34 ,  H01L21/00 ,  H01L23/00 ,  H01L21/683 ,  H01L21/67 ,  H01L23/66 ,  H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L25/065

Abstract: Devices and methods for processing singulated radio-frequency (RF) units. In some embodiments, a device for processing singulated RF packages can include a plate having a plurality of apertures. Each aperture can be dimensioned to receive and position a singulated RF package to thereby facilitate processing of the singulated RF packages positioned in their respective apertures. In some embodiments, such a device can be utilized to batch process high volume of RF packages as if the RF packages are still in a panel format.

公开(公告)号：US10061885B2

公开(公告)日：2018-08-28

申请号：US15615632

申请日：2017-06-06

Applicant: Skyworks Solutions, Inc.

Inventor： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC: G04B1/04 ,  G06F17/50 ,  H05K1/18 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/58 ,  H01L23/66

CPC classification number: G06F17/5072 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of a radio frequency (RF) isolation structure of a packaged module and forming the resulting RF isolation structures. Based on electromagnetic interference data for a module, an area of the module that is less sensitive to external radiation is identified. A racetrack layout can be determined based on identifying the area that is less sensitive to external radiation. The racetrack layout can include a narrowed section in the area that is less sensitive to external radiation or a break in the area that is less sensitive to external radiation.

公开(公告)号：US09871599B2

公开(公告)日：2018-01-16

申请号：US14883399

申请日：2015-10-14

Applicant: Skyworks Solutions, Inc.

Inventor： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC: H04B1/04 ,  H04B15/02 ,  H01L23/552 ,  H04B1/16 ,  H01L21/56 ,  H01L23/00 ,  H01Q1/52 ,  H04B1/44 ,  H05K1/02 ,  H05K1/11 ,  H01L23/522 ,  G06F17/50 ,  H04B15/04

CPC classification number: H04B15/02 ,  G06F17/5081 ,  H01L21/561 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01Q1/526 ,  H04B1/16 ,  H04B1/44 ,  H04B15/04 ,  H05K1/023 ,  H05K1/115 ,  H05K2201/09618 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.

公开(公告)号：US09381529B2

公开(公告)日：2016-07-05

申请号：US14023841

申请日：2013-09-11

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Matthew Sean Read

IPC: B05B9/04 ,  H05K1/02 ,  B05B12/08 ,  B05B7/24 ,  H05K3/28

CPC classification number: B05B9/042 ,  B05B1/3046 ,  B05B7/04 ,  B05B7/06 ,  B05B7/0815 ,  B05B7/2427 ,  B05B12/081 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/049 ,  H05K2203/1344 ,  H05K2203/1366

Abstract: In applications such as manufacture of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to maintain an acceptable level of suspension of paint particles in solution. A closed recirculation system can be configured to provide such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the recirculator can include a compact peristaltic pump that allows use of shorter fluid paths in the closed recirculation system, as well as a desired level of agitation to quickly achieve the acceptable level of suspension and maintain the suspension for an extended period of time.

Abstract translation: 在诸如制造屏蔽射频模块的应用中，其中喷射昂贵的金属涂料以形成导电层，期望减少所用涂料的量，并且保持涂料颗粒在溶液中的可接受水平的悬浮液。 闭合的再循环系统可以被配置成提供这样的期望的特征，并且可以包括用于保持一定量的金属涂料的储存器，用于喷射从贮存器接收的金属漆的喷射装置，以及用于再循环未喷涂的金属涂料的再循环器 回到水库。 在一些实施例中，再循环器可以包括紧凑的蠕动泵，其允许在封闭的再循环系统中使用更短的流体路径，以及期望的搅动水平以快速达到可接受的悬浮水平并将悬架保持长时间 时间。

公开(公告)号：US20160181206A1

公开(公告)日：2016-06-23

申请号：US14975473

申请日：2015-12-18

Applicant: Skyworks Solutions, Inc.

Inventor： Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Howard E. Chen ,  Dinhphuoc Vu Hoang

IPC: H01L23/552 ,  H01Q1/52 ,  H01L23/66 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/563 ,  H01L21/565 ,  H01L23/66 ,  H01L24/27 ,  H01L24/32 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6672 ,  H01L2224/29139 ,  H01L2224/29194 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/19107 ,  H01Q1/526 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).

公开(公告)号：US20160163661A1

公开(公告)日：2016-06-09

申请号：US15046258

申请日：2016-02-17

Applicant: Skyworks Solutions, Inc.

Inventor： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L23/58

CPC classification number: G06F17/5072 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Aspects of the present disclosure relate to a racetrack that forms part of an RF isolation structure of a packaged module and wireless devices that include such a packaged module. The racetrack can be disposed in a substrate and around an RF component that is on the substrate. The racetrack can include at least one break and/or at least one narrowed section without significantly degrading the EMI performance of the RF isolation structure.

Abstract translation: 本公开的方面涉及形成封装模块的RF隔离结构的一部分的赛道和包括这种封装模块的无线设备。 赛道可以设置在基板上并且围绕在基板上的RF部件周围。 赛道可以包括至少一个断路和/或至少一个变窄部分，而不会明显降低RF隔离结构的EMI性能。