Invention Grant
- Patent Title: Packaging substrate and method of fabricating the same
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Application No.: US16007490Application Date: 2018-06-13
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Publication No.: US10204854B2Publication Date: 2019-02-12
- Inventor: Yuki Nitta
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2016-010931 20160122
- Main IPC: H01L23/15
- IPC: H01L23/15 ; H01L23/498 ; H01L21/48
Abstract:
The packaging substrate according to the present invention is a packaging substrate including: a core substrate; an insulating layer formed on one surface or each of both surfaces of the core substrate; and one or more wiring layers formed on the insulating layer and/or embedded in the insulating layer. The packaging substrate has a thin layer portion where the insulating layer is partially thinned at an outer peripheral portion of the insulating layer.
Public/Granted literature
- US20180294217A1 PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME Public/Granted day:2018-10-11
Information query
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