公开(公告)号：US10204854B2

公开(公告)日：2019-02-12

申请号：US16007490

申请日：2018-06-13

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Yuki Nitta

IPC: H01L23/15 ,  H01L23/498 ,  H01L21/48

Abstract: The packaging substrate according to the present invention is a packaging substrate including: a core substrate; an insulating layer formed on one surface or each of both surfaces of the core substrate; and one or more wiring layers formed on the insulating layer and/or embedded in the insulating layer. The packaging substrate has a thin layer portion where the insulating layer is partially thinned at an outer peripheral portion of the insulating layer.

公开(公告)号：US20200266077A1

公开(公告)日：2020-08-20

申请号：US16865905

申请日：2020-05-04

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Yuki Nitta

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/15 ,  H01L23/13 ,  H01L23/12 ,  H05K3/00 ,  H05K3/46

Abstract: The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

公开(公告)号：US10679865B2

公开(公告)日：2020-06-09

申请号：US16445606

申请日：2019-06-19

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Yuki Nitta

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H01L23/12

Abstract: The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

公开(公告)号：US11081368B2

公开(公告)日：2021-08-03

申请号：US16865905

申请日：2020-05-04

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Yuki Nitta

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H01L23/12

Abstract: The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.