Invention Grant
- Patent Title: Providing power to integrated electronics within a cable
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Application No.: US15043712Application Date: 2016-02-15
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Publication No.: US10205325B2Publication Date: 2019-02-12
- Inventor: Bradley Saunders , Robert Dunstan
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H01B7/30
- IPC: H01B7/30 ; H01B11/02 ; H02J4/00 ; G02B6/42 ; G06F1/26

Abstract:
A method of providing power to electronics within a cable is described. The method may include communicatively coupling a first device to a second device via a cable. The cable may include electronic components integrated within the cable. The method may also include providing a signal from the first device to the second device. The method may also include providing, via an internal power line within the cable, power to the integrated electronic components. The method may also include providing, via a device power line within the cable, power between the first device and the second device, wherein the internal power line and the device power line are electrically isolated from one another inside the cable.
Public/Granted literature
- US20160226259A1 Providing Power to Integrated Electronics Within a Cable Public/Granted day:2016-08-04
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