Invention Grant
- Patent Title: Laser processing apparatus
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Application No.: US15205603Application Date: 2016-07-08
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Publication No.: US10207362B2Publication Date: 2019-02-19
- Inventor: Wataru Odagiri , Taku Iwamoto , Kentaro Odanaka , Hironari Ohkubo , Shuichiro Tsukiji , Kouichi Nehashi , Joel Koerwer
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2015-143399 20150717
- Main IPC: B23K26/03
- IPC: B23K26/03 ; B23K26/06 ; B23K26/08 ; B23K26/36 ; B23K26/402 ; H01L21/67 ; H01L21/78 ; H01L21/26 ; B23K26/364 ; H01L21/268 ; H01L21/82 ; B23K103/00 ; H01L21/66

Abstract:
A laser beam irradiation unit of laser processing apparatus includes a pulse laser beam oscillating unit, a condenser that condenses a pulse laser beam and emits the beam to a workpiece held by a chuck table, a dichroic mirror disposed between the pulse laser beam oscillating unit and the condenser, a strobe light irradiation unit that emits light to a path on which the dichroic mirror and the condenser are disposed, a beam splitter disposed between the strobe light irradiation unit and the dichroic mirror, and an imaging unit disposed on the path of light split by the beam splitter. A controller actuates the strobe light irradiation unit and the imaging unit according to the timing of the pulse laser beam, and detects the width of a laser-processed groove immediately after emission of the pulse laser beam on the basis of an image signal from the imaging unit.
Public/Granted literature
- US20170014947A1 LASER PROCESSING APPARATUS Public/Granted day:2017-01-19
Information query
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