Invention Grant
- Patent Title: LED lighting device and lamp shade, and circuit preparation method thereof
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Application No.: US15114831Application Date: 2015-01-27
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Publication No.: US10208896B2Publication Date: 2019-02-19
- Inventor: Bishou Chen , Li Xu , Peng Wang , Xiaoliang He , Sheng Li , Haibo Liu
- Applicant: SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD , SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD , JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO., LTD
- Applicant Address: CN Shanghai CN Shanghai CN Jiaxing, Zhejiang
- Assignee: SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD,SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD,JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO., LTD
- Current Assignee: SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD,SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD,JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO., LTD
- Current Assignee Address: CN Shanghai CN Shanghai CN Jiaxing, Zhejiang
- Priority: CN201410040724 20140127; CN201410040726 20140127; CN201410193097 20140508
- International Application: PCT/CN2015/071639 WO 20150127
- International Announcement: WO2015/110086 WO 20150730
- Main IPC: F21K9/232
- IPC: F21K9/232 ; F21V29/85 ; F21V29/506 ; F21V3/02 ; F21V23/00 ; F21K9/238 ; F21K9/235 ; F21K9/237 ; B05D3/02 ; F21V19/00 ; F21V3/10 ; F21Y113/00 ; F21K9/20 ; F21V29/74 ; F21V29/83 ; F21Y115/10 ; F21V17/10 ; H05K1/02 ; H05K1/09 ; H05K3/00 ; F21V3/06

Abstract:
An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base, an LED light unit, and a lamp shade. The LED light-emitting unit and the lamp shade are arranged on the base. The lamp shade covers the LED light-emitting unit inside. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 μm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000° C. until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling.
Public/Granted literature
- US20160341368A1 LED LIGHTING DEVICE AND LAMP SHADE, AND CIRCUIT PREPARATION METHOD THEREOF Public/Granted day:2016-11-24
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