Invention Grant
- Patent Title: Film for flip chip type semiconductor back surface and its use
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Application No.: US14191562Application Date: 2014-02-27
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Publication No.: US10211083B2Publication Date: 2019-02-19
- Inventor: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-170807 20100729
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/31 ; H01L23/00
Abstract:
The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200° C. or more or a metal.
Public/Granted literature
- US20140178680A1 FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE Public/Granted day:2014-06-26
Information query
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