Invention Grant
- Patent Title: Apparatus for cutting substrate and system for processing same
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Application No.: US15816247Application Date: 2017-11-17
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Publication No.: US10211105B2Publication Date: 2019-02-19
- Inventor: Bing-Joe Hwang , Wei-Nien Su , Jeng-Ywan Jeng , Yuan-Han Chu , Tse-Ming Chiu , Hsin-Fu Teng
- Applicant: National Taiwan University of Science and Technology
- Applicant Address: TW Taipei
- Assignee: National Taiwan University of Science and Technology
- Current Assignee: National Taiwan University of Science and Technology
- Current Assignee Address: TW Taipei
- Agency: Volpe and Koenig, P.C.
- Priority: TW104104167A 20150206
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/78 ; B28D5/04 ; H01L21/3063
Abstract:
An apparatus for cutting a substrate is disclosed. The apparatus includes a main body containing a reactive solution and the substrate; and a catalytic cutting element disposed inside the main body and contacting one of at least two adjacent cutting peripheries of the substrate to conduct a chemical reaction to cut the substrate.
Public/Granted literature
- US20180076089A1 APPARATUS FOR CUTTING SUBSTRATE AND SYSTEM FOR PROCESSING SAME Public/Granted day:2018-03-15
Information query
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