Invention Grant
- Patent Title: Semiconductor device package
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Application No.: US15618085Application Date: 2017-06-08
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Publication No.: US10211137B2Publication Date: 2019-02-19
- Inventor: Chien-Hua Chen , Sheng-Chi Hsieh , Cheng-Yuan Kung
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/498 ; H05K1/16 ; H01L21/48 ; H01L23/538
Abstract:
A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.
Public/Granted literature
- US20180358291A1 SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2018-12-13
Information query
IPC分类:
